http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109003910-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-60 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06T7-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06T7-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06T7-62 |
| filingDate | 2018-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109003910-B |
| titleOfInvention | Irregular wafer testing method based on full-automatic probe station and computer readable storage medium thereof |
| abstract | The invention relates to an irregular wafer testing method based on a full-automatic probe station and a computer readable storage medium thereof, wherein the computer readable storage medium stores a program, the program is executed by a processor of the full-automatic probe station to realize the method, the irregular wafer is placed on the top surface of conductive adhesive, and is placed on a wafer bearing table through an aluminum plate on the bottom surface of the conductive adhesive. Because the central axis of the ventilation round hole on the conductive adhesive inclines, the camera device can not shoot the aluminum plate on the bottom surface of the conductive adhesive. In the testing process, the image shot by the camera device is subjected to gray processing, the outer contour of the gray-value nonzero color block with the largest periphery is selected as the edge of the irregular wafer, the minimum circumscribed circle/the maximum inscribed circle of the irregular wafer is determined by selecting the initial circle center of the irregular wafer, and the minimum circumscribed circle/the maximum inscribed circle are used as the wafer scanning area to carry out full-wafer scanning/edge scanning, so that the testing of the irregular wafer by the full-automatic probe station is realized. |
| priorityDate | 2018-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804 |
Total number of triples: 16.