http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108948360-B
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-398 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-398 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 |
filingDate | 2017-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2020-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2020-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-108948360-B |
titleOfInvention | Metal-containing carboxylic acid type polyhedral oligomeric silsesquioxane, preparation method thereof and cyanate resin composition containing metal-containing carboxylic acid type polyhedral oligomeric silsesquioxane |
abstract | The invention discloses a metal-containing carboxylic acid type polyhedral oligomeric silsesquioxane, a preparation method thereof and a cyanate resin composition containing the metal-containing carboxylic acid type polyhedral oligomeric silsesquioxane, wherein the metal-containing carboxylic acid type polyhedral oligomeric silsesquioxane is obtained by reacting polyhedral oligomeric silsesquioxane containing a plurality of carboxyl groups, a metal compound and optionally sodium hydroxide as raw materials; the method can be obtained by reacting polyhedral oligomeric silsesquioxane containing a plurality of carboxyl groups with metal alkoxide, or adding a sodium hydroxide solution and a metal chloride solution into a polyhedral oligomeric silsesquioxane solution containing a plurality of carboxyl groups; the composition comprises a cyanate ester resin and the metal-containing carboxylic acid type polyhedral oligomeric silsesquioxane. The POSS structure in the metal-containing carboxylic acid type polyhedral oligomeric silsesquioxane is not damaged, and is T 8 The epoxy resin has a condensation structure, can obviously reduce the curing temperature of materials such as cyanate resin, benzoxazine resin and the like, and has obvious curing and catalyzing effects. |
priorityDate | 2017-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 80.