| abstract |
The present invention provides a kind of silver thin film etchant composition and the forming method that utilizes this silver thin film etchant composition etching method and metal pattern, and above-mentioned silver thin film etchant composition is characterized in that, with respect to composition gross weight, comprises ( A) 1 to 15% by weight of inorganic acid, (B) 30 to 73% by weight of organic acid, (C) 0.5 to 15% by weight of inorganic salt and (D) water as the balance. The silver thin film etchant composition is used for etching a single-layer film composed of silver (Ag) or silver alloy, and a multi-layer film composed of the above-mentioned single-layer film and transparent conductive film, and provides the effect that no residue and silver re-adsorption problems occur . |