| abstract |
The invention discloses a kind of modified additive, modified epoxy plastic packaging material and preparation method thereof, the plastic packaging material includes following components：Tricyanic epoxy resin, ACR resin, perfluorinated sulfonic resin, 107 rubber powders, silicone powder, modified additive, zinc dialkyl dithiophosphate, pyridine carboxylic acid magnesium, niacin butyl ester (acidum nicotinicum butyl ester), N- methyl -4- cyano benzylamine, cashew nut shell oil, heptadecyl imidazole quinoline, 2,3- difluoro phenyl boric acid, trioctyl trimellitate (TOTM), two iso stearyl metatitanic acid second diester, Polyethylene Glycol Oleate.Linear expansion coefficient, mechanical property and the heat resistance of modified epoxy plastic packaging material provided by the invention reach a higher level, of good reliability, can meet the requirement of Electronic Encapsulating Technology. |