| abstract |
The invention discloses a halogen-free resin composition, which comprises the following components dispersed in an organic solvent in parts by weight: 10-20 parts of phosphorus-containing epoxy resin, 10-15 parts of multifunctional epoxy resin, polyurethane and 35-50 parts of polyamide block copolymer, 10-20 parts of MQ resin, 5-10 parts of amine curing agent, 5-15 parts of phosphorus-containing flame retardant; A cover film prepared from a resin composition; the cover film has excellent flexibility, low ion content, no dendrites in the ion migration resistance test, good insulation, and excellent peel strength, heat resistance, size Stability, chemical resistance, storage and processing performance, flame retardancy can reach UL94 VTM‑0 level. |