| abstract |
The present invention relates to epoxy resin compositions and semiconductor devices. The present invention provides an epoxy resin composition containing (A) an epoxy resin, (B) an arylamine-based curing agent, and (C) a curing accelerator in the form of an aryl borate, wherein the component ( The equivalent ratio of amino groups in B) to epoxy groups in component (A) is 0.7/1 to 1.5/1. The composition has low temperature curability and processability, and adhesion and adhesion retention are also improved. |