http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108831850-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-22 |
| filingDate | 2018-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-108831850-B |
| titleOfInvention | Binary splitting method of splitting bar for semiconductor laser |
| abstract | A binary splitting method of a splitting bar for a semiconductor laser comprises the following steps: a) equally dividing the plate into two semicircular plates on average; b) finishing film covering; c) dividing the fan-shaped piece into two equal fan-shaped pieces; d) cutting into two equally divided wafer blocks; e) judging whether the width of the wafer block is 2-3 times larger than the width of the bar, stopping splitting when the width of the wafer block is 2-3 times smaller than the width of the bar, and executing the step f when the width of the wafer block is 2-3 times larger than the width of the bar); f) carrying out splitting operation along the splitting line to divide the wafer block; g) and c) operating the wafer blocks divided in the step f) according to the method in the step e). The problem of serious crushing damage to the cavity surface when the wafer is split into the strips one by one is solved, the product quality is greatly improved on the premise of ensuring the production efficiency, and the yield is greatly improved. And the pressure marks of the P surface and the N surface of the bar are reduced in the splitting process, the quality is ensured, the cost is saved, and the production efficiency is improved. |
| priorityDate | 2018-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.