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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J161-34
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-34
filingDate 2018-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-108822778-B
titleOfInvention Low-temperature fast curing environment-friendly adhesive and preparation method thereof
abstract The invention relates to a low-temperature fast curing environment-friendly adhesive and a preparation method thereof, wherein the adhesive comprises the following raw materials: phenol, resorcinol, urea and formaldehyde, wherein the molar ratio of the phenol to the urea to the formaldehyde is 1.0:1.0-1.3:2.9-3.4, and the mass percentage of the resorcinol to the phenol is 0.01-0.1: 1. The preparation method comprises the steps of raw material preparation and phenol-resorcinol-urea-formaldehyde (PRUF) copolycondensation reaction; compared with the traditional phenolic resin adhesive, the PRUF quaternary copolycondensation resin adhesive has the advantages of low curing temperature and short curing time; has the characteristics of good waterproof performance, ultralow formaldehyde release, excellent performance, simple preparation process and the like. The bonding strength of the plywood prepared by using the adhesive disclosed by the invention meets the national class I board strength standard, the minimum formaldehyde release amount is 0.06mg/L and is far lower than the national E0-level limit requirement, so that the adhesive is suitable for the production of plywood, shaving boards, fiber boards and the like, and can also be directly applied to indoor home decoration and outdoor waterproof structures.
priorityDate 2018-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 32.