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filingDate 2018-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_128a895709e3002ba5e42648d6cf71fa
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e64e46a7006dcb4051c8d62a7efd8e71
publicationDate 2018-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-108766871-A
titleOfInvention A Direct Write Plasma Spraying Technology Applied in Semiconductor Industry
abstract The invention relates to a direct writing plasma spraying technology applied in the semiconductor industry. For the coated parts in the semiconductor, the direct writing plasma spraying technology is used to write the sensor on the coating, and the change of the coating quality is monitored through the sensor, so that the coating of the part can be changed before the coating reaches the life limit. The claimed method includes: (1) coating a functional coating according to the needs of semiconductor parts; (2) spraying other coatings on a small area above the coating, and the coating needs to be in a certain performance and the first There are obvious differences in the functional coating of the first layer, which cannot be coated with sensitive metals in the semiconductor industry; (3) above the second layer of coating, spray a coating of the same material as the first layer of coating, the coating The thickness of the coating is slightly smaller than the first layer; (4) Spray radio above the coating to connect external monitoring equipment.
priorityDate 2018-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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