http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108754467-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 |
| filingDate | 2018-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-108754467-B |
| titleOfInvention | Ruthenium palladium alloy chemical plating solution and plating method and application thereof |
| abstract | The invention discloses a ruthenium palladium alloy chemical plating solution, application thereof and a method for chemically plating a ruthenium palladium alloy layer. The ruthenium-palladium alloy electroless plating solution comprises a solvent, water-soluble ruthenium salt with the concentration of 0.1-10 mmol/L, water-soluble palladium salt with the concentration of 0.1-10 mmol/L, a complexing agent with the concentration of 1-20 mmol/L, an auxiliary agent with the concentration of 1-50 mmol/L, hydrazine hydrate with the concentration of 1-20 mmol/L and a pH regulator. The ruthenium palladium alloy electroless plating solution can be applied to electronic devices and printed circuit boards. The method for chemically plating the ruthenium palladium alloy layer comprises the step of placing a substrate in the ruthenium palladium alloy chemical plating solution for plating treatment. The ruthenium-palladium alloy chemical plating solution has good stability, high palladium-ruthenium deposition rate, controllability, high ruthenium content in a plating layer, good quality of the plating layer and good combination with a substrate and a subsequent plating layer. In addition, the chemical plating condition of the ruthenium palladium alloy chemical plating solution is mild. |
| priorityDate | 2018-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.