| titleOfInvention |
Polyimide, adhesive, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and manufacturing method |
| abstract |
The present invention provides a polyimide, an adhesive, an adhesive material, an adhesive layer, an adhesive sheet, a copper foil, a copper-clad laminate, a wiring board, and a manufacturing method. The present invention provides a polyimide which is a reaction product of a monomer group comprising an aromatic tetracarboxylic acid anhydride and a diamine comprising a dimerized diamine, and which comprises a fluorenylene group in the main chain of the polymer, and a polyimide comprising a polyimide, Adhesives of bonding agents and organic solvents, film-like adhesive materials, adhesive layers, adhesive sheets, copper foils with resins, copper-clad laminates, printed wiring boards, and multilayer wiring boards, and manufacturing methods thereof. |