| abstract |
The invention discloses a kind of good integrated circuit modified epoxy plastic packaging materials of mechanical property, by weight, contain following components：70 parts of tricyanic epoxy resin, 20 parts of ACR resins, 13 parts of perfluorinated sulfonic resin, 8 parts of 107 rubber powder, 6 parts of silicone powder, modified 4 parts of additive, 7 parts of zinc dialkyl dithiophosphate, 5 parts of pyridine carboxylic acid magnesium, 8 parts of niacin butyl ester (3 pyridine carboxylic acid butyl ester), 15 parts of 4 cyano benzylamine of N methyl, 12 parts of cashew nut shell oil, 8 parts of heptadecyl imidazole quinoline, 5 parts of 2,3 difluoro phenyl boric acid, 8 parts of trioctyl trimellitate (TOTM), two 7 parts of iso stearyl metatitanic acid second diester, 9 parts of Polyethylene Glycol Oleate；The modified additive includes that mass ratio is 1:5 modified aluminium powder and modified glass powder；The modified glass powder is the modification glass powder that glass powder is obtained by ammonium hydroxide and 602 Combined Treatments of silane coupling agent KH and after being milled to 60 or 200 mesh. |