http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108588594-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C49-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C49-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C47-14 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C101-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C49-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C49-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C47-14 |
| filingDate | 2018-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-108588594-B |
| titleOfInvention | Electronic insulation packaging material and preparation method thereof |
| abstract | The invention discloses an electronic insulation packaging material and a preparation method thereof, wherein the electronic insulation packaging material comprises the following raw materials in parts by weight: 10-15 parts of diamond, 20-30 parts of silicon carbide, 10-20 parts of carbon fiber, 15-30 parts of epoxy resin, 20-30 parts of heat-conducting inorganic nano particles, 10-20 parts of anticorrosive agent, 10-15 parts of toughening agent, 20-25 parts of polyamide and 30-40 parts of matrix. According to the invention, the diamond, the silicon carbide and the carbon fiber all have high hardness, the composite material prepared by mixing the diamond, the silicon carbide and the carbon fiber has very high hardness, the hardness is improved by 20-30% compared with that of a common material, meanwhile, the carbon fiber has very strong heat-conducting property, the heat dissipation of an electronic product is facilitated, the toughness of the material is improved by 37-57% by adding the toughening agent, so that an electronic element cannot generate cracks due to vibration impact, the electronic element is effectively protected, the service life of the electronic element is prolonged by 2-3 times, the electronic insulation packaging material has high hardness and toughness, the heat conductivity and the insulativity of the material are greatly improved, and the electronic insulation packaging material has. |
| priorityDate | 2018-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 55.