http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108587560-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-07 |
| filingDate | 2018-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-108587560-B |
| titleOfInvention | Resinated organic silicon electronic packaging adhesive composition |
| abstract | The invention relates to the technical field of preparation of electronic encapsulating materials, in particular to a resinified organic silicon electronic encapsulating adhesive composition. The packaging adhesive composition consists of a component A and a component B, wherein the component A and the component B are mixed according to a mass ratio of 1:1, curing after mixing and defoaming, wherein the component A comprises the following materials in parts by mass: 20-40 parts of mixed reinforcing filler, 12.5-25 parts of vinyl silicone oil, 5-16 parts of tackifier and 0.006-0.014 part of platinum catalyst; wherein the component B comprises the following materials in parts by mass: 15-40 parts of mixed reinforcing filler; 10-25 parts of vinyl silicone oil; 5-16 parts of a fluidity regulator; 10-20 parts of reinforced polysiloxane; 6-20 parts of a cross-linking chain extender; 1-8 parts of an inhibitor. The heat conductivity, tensile strength and elongation at break of the electronic pouring sealant are obviously improved, the polarity of the tackifier and the powder is weakened, intermolecular acting force is weakened, and a good bonding effect is formed. |
| priorityDate | 2018-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.