| abstract |
The invention discloses a metal bump device and a manufacturing method thereof, and relates to the technical field of semiconductors. The manufacturing method comprises the following steps: providing a substrate structure, the substrate structure comprising: a substrate and a metal layer over the substrate, the metal layer having a recess; forming a metal bump on the notch of the metal layer by a ball-planting process; and forming a solder paste on the metal bump through a printing process. Compared with the chemical plating method in the prior art, the method of the invention has the advantages of shorter time, higher efficiency and lower cost. |