http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108511407-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate | 2018-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-108511407-B |
| titleOfInvention | Thermal interface material and preparation method and application method thereof |
| abstract | The invention discloses a thermal interface material, a preparation method and an application method thereof. The preparation method of the thermal interface material comprises the following steps: s1, selecting a foam metal material as a substrate; s2, performing surface cleaning treatment on the substrate; and S3, loading low-melting-point metal and/or alloy on the upper surface and the lower surface of the substrate obtained in the step S2 to obtain the foam metal material with a sandwich structure as a thermal interface material. The thermal interface material prepared by the invention has higher thermal conductivity and can be suitable for heat dissipation of semiconductor power devices. |
| priorityDate | 2018-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.