| abstract |
The present invention relates to semiconductor devices, methods of making them and methods of strengthening dies therein. A semiconductor device may include: a die including a first main surface, a second main surface and a side surface, the side connecting the first main surface and the second main surface; at least one conductive pillar, the at least one a conductive post disposed on the first major face of the die and electrically coupled to the die; and an insulator disposed on the first major face of the die, the insulator comprising an upper major face and A side, wherein the at least one conductive pillar is exposed on an upper major surface of the insulator, and wherein a side of the die and a side of the insulator are coplanar. |