http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108372431-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B57-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B57-02 |
| filingDate | 2018-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-108372431-B |
| titleOfInvention | Chemical Mechanical Polishing Methods for Tungsten |
| abstract | A method of chemically mechanically polishing a tungsten-containing substrate to reduce etch rates and inhibit tungsten dishing and underlying dielectric erosion is disclosed. The method includes providing a substrate; providing a polishing composition containing as initial components: water, an oxidizing agent, a dihydroxydisulfide, a dicarboxylic acid, a source of iron ions, a colloidal silica abrasive, and optionally providing a chemical mechanical polishing pad with a polishing surface; establishing dynamic contact at the interface between the polishing pad and the substrate; and dispensing the polishing composition to the polishing pad and the substrate On a polished surface at or near the interface between substrates; where some tungsten (W) is polished away from the substrate, reducing the etch rate, inhibiting tungsten (W) sinking and dielectric erosion of the tungsten (W) underlying layers. |
| priorityDate | 2017-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.