http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108340094-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3006 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-40 |
| filingDate | 2017-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-108340094-B |
| titleOfInvention | Ag-Cu-In-Sn-Ti alloy solder and preparation method and application thereof |
| abstract | The invention relates to an Ag-Cu-In-Sn-Ti alloy solder and a preparation method thereof, belonging to the field of low-melting-point active solders of metal-ceramic and ceramic-ceramic. The brazing filler metal comprises the following components: 22-26 wt.% of Cu, 8-12 wt.% of In, 8-12 wt.% of Sn, 2-6 wt.% of Ti, 0.05-2 wt.% of Mo, 0.05-2 wt.% of Mn, 0.01-1 wt.% of glass powder and the balance of Ag. The invention also discloses a preparation method of the brazing filler metal. The brazing filler metal has low melting temperature, good wettability to ceramics, good brazing manufacturability, high weld strength, good matching of the brazing filler metal and the ceramic linear expansion coefficient, and is suitable for welding of ceramics and metal ceramics. |
| priorityDate | 2017-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.