| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0736 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1642
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
2016-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67f134de69f06da6601473b7fdb80ba1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb2fe535222776797d2d374cebd51c5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b78992d333a52fb4776f4cc5c45b79a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_894da4ad11c00c89991840908ea35edf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_718825585fa6e857bd5b651d6f5a5367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0171079f31eba9611bbb1357abdbbe5b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2ad1c3ad155342e38849d635d60ffc7 |
| publicationDate |
2018-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-108291307-A |
| titleOfInvention |
Plating bath composition and method for electroless plating of palladium |
| abstract |
The present invention relates to aqueous plating bath compositions and methods for depositing palladium layers onto substrates by electroless immersion plating. The aqueous plating bath composition according to the invention comprises a source of palladium ions, a reducing agent of palladium ions and an unsaturated compound. The aqueous plating bath composition according to the invention has improved stability against undesired decomposition due to said unsaturated compounds while maintaining the deposition rate of palladium at a desired satisfactory value. The aqueous plating bath compositions also have an extended useful life. The unsaturated compounds of the invention enable adjustment of the deposition rate to a satisfactory range during the service life of the bath and enable electroless deposition of palladium layers at lower temperatures. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114086160-A |
| priorityDate |
2015-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |