http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108291121-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10 |
| filingDate | 2016-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-108291121-B |
| titleOfInvention | Anisotropic conductive film and connection structure using the same |
| abstract | The present invention provides an anisotropic conductive film including a conductive layer and a dielectric layer and a connection structure using the same. One of the conductive layer and the dielectric layer includes two kinds of inorganic fillers having different particle sizes, and the dielectric layer has a higher rate of expansion length increase calculated by Equation 1 than the conductive layer at 50° C. to 80° C. and 1.0 MPa to 3.0 MPa to perform preliminary compression on the conductive film for 1 to 3 seconds and at 120 to 160° C. and 60 to 90 MPa to perform a main compression of the conductive film for 3 to 6 seconds after the measurement, and the anisotropic conductive film Has a storage modulus of about 2.5 GPa to about 5 GPa measured at a cure rate of 90% or higher. In addition, by increasing the dispersibility of the conductive particles, the anisotropic conductive film can exhibit excellent characteristics in improving insulation performance and connection reliability. <Formula 1> Development length increase rate (%)={(lateral length of target layer after main compression−lateral length of target layer before preliminary compression)/lateral length of target layer before preliminary compression}× 100%. |
| priorityDate | 2015-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 53.