| abstract |
The present invention provides a resin composition capable of improving desmearability, reducing the dielectric loss tangent of a cured product, and improving the heat resistance of the cured product. The resin composition of the present invention, the resin composition, which contains an active ester compound, and has a structure shown in the following formula (1), and a substituent is bonded to the benzene ring in the structure shown in the following formula (1). Structure, the structure represented by the following formula (2), the structure represented by the following formula (2) in which a substituent is bonded to the benzene ring, the structure represented by the following formula (3), the following formula (3 ) in which a substituent is bonded to the benzene ring, a structure represented by the following formula (4), or a structure represented by the following formula (4) in which a substituent is bonded to the benzene ring Structured compounds. The structure shown in the formula (1), formula (2), formula (3) or (4) has a phenylene or naphthylene group, and a heteroatom, a group formed by bonding a hydrogen atom on the heteroatom or carbonyl. |