abstract |
The present invention provides a kind of electronic package material and electronic devices, calculate in percentage by weight, are prepared using the following raw material:38 parts by weight of sodium lignin sulfonate, 16 parts by weight of zinc oxide, 4 10 parts by weight of diisooctyl phthalate, 10 20 parts by weight of polyetherimide, 30 60 parts by weight of epoxy resin, 8 18 parts by weight of silicon carbide, 39 parts by weight of nano magnesia, 0.3 0.8 parts by weight of AEO carboxylic acid sodium.Compared with prior art, the present invention is using sodium lignin sulfonate, zinc oxide, diisooctyl phthalate, polyetherimide, epoxy resin, silicon carbide, nano magnesia, AEO carboxylic acid sodium as raw material, each ingredient interaction influences each other, the intensity and wearability of the electronic package material of preparation are improved, to have the characteristics that intensity is high, wearability is good. |