| abstract |
The present invention relates to a photovoltaic encapsulation material with high light transmittance. In the present invention, 100 parts by mass of a photovoltaic encapsulation material matrix resin or graft-modified matrix resin, 0.001-5 parts by mass of an oxygen- or sulfur-containing compound, 0.01- 10 parts by mass of reactive plasticizer, 0.01-1.5 parts by mass of initiator, 0.01-10 parts by mass of co-crosslinking agent, 0.1-3.0 parts by mass of silane coupling agent, 0.1-0.4 parts by mass of ultraviolet absorber 0.1 to 1.0 parts by mass of light stabilizer is used to prepare photovoltaic packaging materials with high light transmittance through pre-mixing, melt extrusion, casting film forming, cooling, slitting and rolling. The invention improves the light transmittance of the photovoltaic encapsulation material, thereby realizes better matching of the refractive index between the glass/front layer encapsulation material/cell sheet, increases the utilization rate of sunlight by the module, and optimizes and improves the photoelectricity of the module. conversion efficiency. |