| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0217
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32183
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-3321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-2485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-24564
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02211 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-505
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32449
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32798
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32935
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45542
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02104 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate |
2017-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-108257842-B |
| titleOfInvention |
Substrate processing apparatus, manufacturing method of semiconductor device, and recording medium |
| abstract |
The present invention relates to a substrate processing apparatus, a method for manufacturing a semiconductor device, and a recording medium. The problem to be solved by the present invention is to provide a technique capable of uniformly processing a substrate. The solution of the present invention includes: a processing chamber for processing a substrate; a gas supply unit for supplying gas into the processing chamber; The gas in the chamber is converted into plasma to activate it; an impedance measuring device measures the impedance of the plasma generating part; a judgment part judges the generation amount of the active species of the plasma according to the value of the impedance measured by the impedance measuring device; and a control unit for controlling the high-frequency power supply based on the amount of active species generated determined by the determination unit. |
| priorityDate |
2016-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |