http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108250976-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_45f314dc7bf9134fbbd14f50866c720e
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
filingDate 2016-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_162e2802302213eaa1b634687e998472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa424db817004e468d97fb4dd2ff7558
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dac4cca9f5b932a164a494a680d6718d
publicationDate 2018-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-108250976-A
titleOfInvention A kind of chemical mechanical polishing liquid
abstract One aspect of the present invention provides a kind of chemical mechanical polishing liquid, and it includes water, the negatively charged abrasive grains in surface can generate the compound of silver ion, can generate the compound of sulfate ion, peroxide.The present invention significantly improves the stability of polishing fluid, further improves polishing stable degree, improves polishing efficiency, reduce polishing cost by changing the charge of abrasive grains silica surface.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111378374-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111378374-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110820048-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111378973-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110820048-A
priorityDate 2016-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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