| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0735 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C3-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C3-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C3-005 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C3-00 |
| filingDate |
2017-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-108217580-B |
| titleOfInvention |
Package Formation Method |
| abstract |
A method for forming a package includes: providing a first substrate on which a plurality of first semiconductor devices are formed; providing a second substrate on which a plurality of second semiconductor devices are formed; and by making the first substrate and The respective dummy pads of the second substrates contact to couple the first substrate and the second substrate, wherein the dummy pads of the first substrate and the dummy pads of the second substrate At least one of the virtual pads includes a plurality of peaks and valleys. |
| priorityDate |
2016-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |