http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108181565-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2017-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-108181565-B |
| titleOfInvention | Automatic testing method for device chips at two ends of beam lead |
| abstract | The invention relates to an automatic test method for device chips at two ends of a beam lead, which comprises the following steps: (1) the test probe card is connected to the semiconductor automatic test probe station; (2) loading a wafer to be tested, straightening, setting test parameters of a probe station and setting test parameters of a power-on system; (3) automatic test of ATE, processing data, outputting MAP, and obtaining test Bin classification; (4) changing down a test double-needle probe card, changing up a damage probe card matched with the test double-needle probe card, straightening, returning to the first point of the test, and increasing the Z value of the vertical test stroke; (5) and (4) carrying out dead pixel retesting according to Bin classification of the MAP. The advantages are that: 1) the damaged probe card is used for detecting dead spots instead of the conventional ATE (automatic test equipment) ink-printing spot marking unqualified chips, the problem that ink spots fall off due to the follow-up separation process of the beam lead chip is ingeniously avoided by the way of matching the two probe cards for testing, and the reliability of testing and screening is greatly improved. 2) The complicated manual unqualified chip selecting process is omitted, and the production efficiency is greatly improved. |
| priorityDate | 2017-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.