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filingDate 2016-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39686992f792012325df3cbb6f90b213
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publicationDate 2018-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-108165010-A
titleOfInvention A kind of high thermal conductivity and low dielectric polyphenylene sulfide composite material and preparation method thereof
abstract The invention provides a high thermal conductivity and low dielectric polyphenylene sulfide composite material and a preparation method thereof. The composite material includes: 100 parts of polyphenylene sulfide resin, 10-40 parts of glass fiber, 30-60 parts of boron nitride, 5 -15 parts of compatibilizer, 0.8-3.0 parts of coupling agent, 1.0-5.0 parts of dispersant, 0.4-1.2 parts of antioxidant; the method includes: mixing boron nitride and coupling agent to obtain the first mixture, and dispersing The agent is added to the first mixture, and the second mixture is obtained after mixing; the polyphenylene sulfide resin, compatibilizer and antioxidant are mixed and then added from the main feeding port of the screw extruder, and the second mixture is extruded from the screw extruder The side feeding port of the machine is added, the glass fiber is added from the glass fiber inlet of the screw extruder, extruded and granulated by the screw extruder, and the polyphenylene sulfide composite material in the form of pellets is obtained; the present invention Polyphenylene sulfide composite materials have the advantages of high thermal conductivity and low dielectric loss, and are suitable for applications in the field of electronic communications.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112592589-A
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