abstract |
The present invention provides a resin capable of forming a cured film (pattern) with less warpage, excellent film uniformity, and less scum (residue) when formed into a cured film, and a composition using the resin, a cured film, A method of producing a cured film and a semiconductor device. A kind of resin, it is selected from polyimide precursor, polyimide, polybenzoxazole precursor and polybenzoxazole, and above-mentioned resin has polymerizable group, and the total amount of the component of molecular weight below 1000 is 0.005 to 1.0% by mass. |