| abstract |
The present invention relates to a multilayer carrier foil, a core structure formed from the multilayer carrier foil, a printed circuit board and an electronic device. The multilayer carrier foil comprises: (a) a copper carrier layer with a release side and a lamination side, the lamination side of the copper carrier layer optionally having roughened particles; (b) a chromium release layer applied to the copper carrier layer (a); (c) an intermediate copper layer, applied to the chromium release layer (b); (d) an anti-migration layer, applied to the intermediate copper layer (c); and (e) an ultra-thin copper layer, applied to the The anti-migration layer (d). The invention also relates to the multi-layer carrier foil, the core structure and the production method of the printed circuit board. |