http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108122727-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-334 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-3174 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32357 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6719 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32422 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32 |
| filingDate | 2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-108122727-B |
| titleOfInvention | Substrate processing apparatus and heat shield |
| abstract | The invention provides a substrate processing apparatus and a heat shield plate. The substrate processing apparatus can uniformly perform a process using radicals on a substrate even if the process is repeated. The process module (13) is provided with: a processing container (28) for accommodating wafers (W); a partition plate (37) disposed between the plasma generation space (P) inside the processing container (28) and the wafer (W); and a heat shield plate (48) disposed between the partition plate (37) and the wafer (W), wherein the partition plate (37) selectively transmits radicals in the plasma generated in the plasma generation space (P) toward the wafer (W), the heat shield plate (48) is disposed so as to face the wafer (W), and the heat shield plate (48) is made of metal and is connected to the processing container (28). |
| priorityDate | 2016-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.