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filingDate 2017-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-108102601-B
titleOfInvention Organic silicon adhesive for packaging ultraviolet LED chip
abstract The invention relates to an organic silicon adhesive for packaging an ultraviolet LED chip, which comprises the following components: 40-50 parts of methyl vinyl silicone resin, 0.01-0.03 part of platinum catalyst, 3-5 parts of binder, 20-30 parts of methyl hydrogen-containing MQ silicone resin, 10-20 parts of epoxy acrylic acid modified hydrogen-containing silicone oil and 0.1-0.2 part of inhibitor. The invention has the beneficial effects that: the high-temperature-resistant retention rate of the packaging glue provided by the invention can be kept above 90%, the ultraviolet resistance is 14-15% higher than that of the common glue, the ultraviolet-resistant effect can be better achieved, and the light attenuation of a light attenuation test of 1000H can meet the international lighting standard within 5%.
priorityDate 2017-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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