http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108076668-B

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filingDate 2016-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2019-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-108076668-B
titleOfInvention Composition for polishing
abstract The composition for polishing that can be ground and can be reduced the scratch on the grinding object object surface to the grinding object object comprising oxygen atom and silicon atom with high grinding rate is provided.A kind of composition for polishing, it is used to grind the grinding object object comprising oxygen atom and silicon atom, the composition for polishing includes average primary particle diameter for 3nm or more and 8nm abrasive grain A below, average primary particle diameter are more than the abrasive grain B and decentralized medium of 8nm, the content of abrasive grain B in aforementioned composition for polishing is more than the content of the aforementioned abrasive grain A in aforementioned composition for polishing, and the average silanol base density of aforementioned abrasive grain A and aforementioned abrasive grain B are 2.0/nm 2 Hereinafter, the draw ratio of aforementioned abrasive grain B is more than 1.3 and is 2.0 or less.
priorityDate 2015-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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