http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108063115-B

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0262
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762
filingDate 2017-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-108063115-B
titleOfInvention TSV adapter plate for system-in-package and preparation method thereof
abstract The invention relates to a TSV adapter plate for system-in-package and a preparation method thereof, wherein the method comprises the following steps: selecting a Si substrate; preparing a plurality of TSVs and a plurality of isolation trenches in the Si substrate; filling the isolation trench and the TSV to form an isolation region and a TSV region respectively; preparing a gate region of the MOS tube on the upper surface of the Si substrate; preparing a source region and a drain region of the MOS tube by using an ion implantation process; preparing an interconnection line between the first end face of the TSV region and the MOS tube on the upper surface of the Si substrate; and preparing a metal salient point on the second end face of the TSV region. According to the TSV adapter plate, the ESD protection device MOS tube is processed on the TSV adapter plate, so that the antistatic capacity of the stacked packaged chip is enhanced.
priorityDate 2017-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8441104-B1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23964
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425762086

Total number of triples: 19.