http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108048026-B

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J177-08
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
filingDate 2017-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-108048026-B
titleOfInvention Polyamide hot melt adhesive for injection molding of low-surface-energy base material and preparation method thereof
abstract The invention discloses a polyamide hot melt adhesive for injection molding of a low-surface-energy base material and a preparation method thereof, wherein the polyamide hot melt adhesive for injection molding of the low-surface-energy base material comprises the following raw materials in percentage by mole: 35-45% of aliphatic dimer acid, 5-20% of aliphatic dicarboxylic acid, 40-55% of aliphatic diamine, 5-40% of polyether polyamine, 0.1-2% of antioxidant, 0.01-0.1% of acid catalyst, 0.5-2% of maleic anhydride and 1.5-15% of EVA resin. The polyamide hot melt adhesive for injection molding of the low-surface-energy substrate has good adhesion to the low-surface-energy injection molding substrate, high thermal stability, high melting point and good chemical resistance to many compounds including many common solvents, plasticizers and oils.
priorityDate 2017-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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