| abstract |
The present invention relates to the fabrication of rings of metal-under-bump UBM structures for inter-die and/or inter-package interconnects and associated systems. A semiconductor die includes: a semiconductor material having solid state components; and interconnects extending at least partially through the semiconductor material. Metal under bump UBM structures are formed over the semiconductor material and are electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure. |