http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107982637-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c6655263ba4852e71280f7529b0065f3 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3754 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3758 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-37211 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-372 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-375 |
| filingDate | 2017-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dea6dce64de1765f6988ebc104b84c9d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c8599a0f083d3dddc81b1289e7c3660 |
| publicationDate | 2018-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107982637-A |
| titleOfInvention | Manufacture method, implantable medical device and the alignment device of implantable medical device |
| abstract | The present invention provides a kind of manufacture method of implantable medical device, implantable medical device and alignment device, and the manufacture method of implantable medical device includes：The implanted packaging body with bio-compatibility is provided, implanted packaging body includes package substrate, and the surface of package substrate is embedded multiple spaced conductive columns；Implanted stimulating electrode with bio-compatibility is provided, implanted stimulating electrode includes the main body equipped with a plurality of metal wire being intervally arranged, positioned at the stimulated side of main body opposite end and Nian Jie end, a plurality of metal wire connection stimulated side and Nian Jie end, each metal line is corresponded in bonding end equipped with connecting through hole；Bonding end is fitted on the surface of package substrate, multiple through holes that connect are aligned one by one with multiple conductive columns；Through hole is connected described in alignment, and is welded in the through hole that connects to form solder joint, the conductive column on the package substrate is electrically connected with the metal wire on the implanted stimulating electrode. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111111006-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111821567-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109999343-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111821568-A |
| priorityDate | 2017-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23987 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419577374 |
Total number of triples: 24.