http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107958895-B
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B69-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B43-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-40 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-11578 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-64 |
filingDate | 2016-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2019-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2019-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-107958895-B |
titleOfInvention | Three-dimensional capacitor and its manufacturing method |
abstract | The integrated circuit includes 3D memory blocks and 3D capacitor blocks. The 3D capacitor includes a plurality of stacks in which a plurality of insulating strips and a plurality of conductive strips are interleaved, a first terminal is connected to the conductive strips in one or more consecutive levels of the stacks, and the conductive strips are used as the 3D capacitor first plate. The second terminal is insulated from the conductive strip to which the first terminal is connected, or is connected to a conductive strip in another or other successive levels of the stack, or is connected to a plurality of posts. Conductive strips that are not intervening are disposed between conductive strips in successive levels. |
priorityDate | 2016-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.