| abstract |
The present invention provides a semiconductor package comprising: a first substrate including a first interconnect structure extending from a surface of the first substrate, the first interconnect structure including particles of a first size; a second substrate including a second interconnect structure including particles of a second size; and a third interconnect structure disposed between the first interconnect structure and the second interconnect structure Between interconnect structures, the third interconnect structure includes a particle of a third size; a first sidewall inclined at a first angle relative to a reference plane; and a second sidewall relative to the reference The plane is inclined at a second angle, wherein the first angle is different from the second angle, the first sidewall is disposed between the first substrate and the second sidewall, and the third dimension is smaller than the first size and this second size. |