http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107931891-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F20-06 |
| filingDate | 2017-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107931891-B |
| titleOfInvention | Solder paste soldering flux |
| abstract | The invention discloses a tin paste soldering flux, wherein a film forming agent of the tin paste soldering flux comprises acrylic resin; the acrylic resin comprises a repeating structural unit of formula (I). The solder paste soldering flux disclosed by the invention has the advantages that the rosin is replaced by the acrylic resin, the corrosivity is low, the residue is less, and the acrylic resin coats the tin powder, so that the tin powder can be prevented from being oxidized. The solder paste added with the solder paste flux has a wide process window: the components in the solder paste have stable properties, and the stability of the solder paste is good; the acrylic resin has good thermal stability and wide reflow soldering temperature range. |
| priorityDate | 2017-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 323.