| abstract |
Embodiments herein may relate to a device having a ball-grid array (BGA) package that includes a plurality of solder balls of a non-eutectic material. In an embodiment, respective ones of the plurality of solder balls may form solder joints between the substrate of the BGA and the second substrate. In some embodiments, the joints may be less than approximately 0.6 microns from each other. Other embodiments may be described and/or claimed. |