| abstract |
The airtightness of the hollow part is maintained, and the yield and durability are improved. A semiconductor device (1) includes a device substrate (2), a semiconductor circuit (3), a package frame (7), a cover substrate (8), a via portion (10), electrodes (11), (12), (13), and bumps block (14) etc. Between the device substrate (2) and the cover substrate (8), a hollow portion (9) that accommodates the semiconductor circuit (3) in an airtight state is provided. The bump portion (14) connects all the via portions (10) and the cover substrate (8). Thereby, the passage portion (10) can be reinforced with the bump portion (14A). |