http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107922655-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2305-72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2311-12 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-043 |
| filingDate | 2016-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107922655-B |
| titleOfInvention | Films for Metal Film Lamination |
| abstract | The present invention provides a patterned film for metal film lamination, which has good adhesion to a metal layer even under high temperature and high humidity conditions, does not discolor the metal layer, and can suppress the occurrence of precipitation during heat treatment. Precipitation of oligomers, even when the shape of the patterned metal layer is deformed, the patterning of the film for metal film lamination becomes finer, the pattern width is designed to be narrower, and the response of the design of the wiring board becomes high precision When used in a type of a high-sensitivity wiring board that has been modified, it is possible to prevent the occurrence of defects due to poor patterning. To provide a film for metal film lamination, which has a coating layer on at least one polyester film surface, the coating layer is formed from a coating liquid containing 70% by weight or more of a crosslinking agent with respect to a non-volatile component, and satisfies the following formula (1). |SMD−STD| , the heating conditions are 150°C, 90 minutes). |
| priorityDate | 2015-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 194.