| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2229-882 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32467
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32119
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3178
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32431
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67017 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate |
2017-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76b09d00efe2d341d03dd39238df37c6 |
| publicationDate |
2018-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-107895682-A |
| titleOfInvention |
chamber with flow source |
| abstract |
The present application discloses a chamber with a flow-through source. The described processing chamber may include a chamber enclosure at least partially defining an interior region of the semiconductor processing chamber. The chamber can include a showerhead positioned within the chamber housing, and the showerhead can at least partially divide the interior region into a remote region and a processing region, which can contain the substrate. The chamber may also include an inductively coupled plasma source positioned between the showerhead and the processing region. An inductively coupled plasma source may include a conductive material within a dielectric material. |
| priorityDate |
2016-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |