| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0159
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68359
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0292
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0214
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0136
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00333
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate |
2016-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-107836036-B |
| titleOfInvention |
Open Mouth Packaging Using Chip Embedding Technology |
| abstract |
In the described example of a method for fabricating a packaged semiconductor device having an open cavity (110a) in panel form, the method includes: combining a panel-sized grid of metal blocks with flat pads (230) and symmetrical Placed vertical posts (231) are placed on adhesive carrier tape; semiconductor chip (101) is attached to tape with sensor system facing down; low CTE insulating material is laminated and thinned to fill between chip and grid. Gap between components; flipping components to remove tape; plasma-cleaning component fronts, sputtering and patterning uniform metal layers across components, and optionally electroplating metal layers to form component-specific rerouted traces and extended contact soldering plate; laminate (212) an insulating stiffener through the faceplate; open a cavity (213) in the stiffener to access the sensor system; and singulate (214) the packaged device by cutting a metal block. |
| priorityDate |
2015-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |