http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107835587-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0271 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2017-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107835587-B |
| titleOfInvention | High-frequency microwave multilayer printed circuit blind slot and manufacturing process thereof |
| abstract | The invention provides a high-frequency multilayer printed circuit blind groove and a manufacturing process thereof, and the high-frequency multilayer printed circuit blind groove comprises a high-frequency multilayer printed circuit board, a blind groove, a full-plate electroplated copper layer, a pattern electroplated copper and a high-frequency signal circuit, wherein the high-frequency multilayer printed circuit board is formed by laminating outer-layer bottom copper, a medium, inner-layer circuit copper and outer-layer bottom copper, the blind groove is arranged on the high-frequency multilayer printed circuit board, the full-plate electroplated copper layer and the pattern electroplated copper are arranged on the blind groove wall of the blind groove, the blind groove bottom of the blind groove is the medium, and the high-frequency signal. The invention solves the manufacturing problems of copper on the wall of the blind groove and no copper at the bottom of the blind groove of the high-frequency multilayer printed circuit, the insulating groove can not be connected with current in the copper plating and tin plating processes, the tin layer protects the pattern copper electroplating during etching, the whole copper electroplating layer at the bottom of the blind groove is etched, and the medium is exposed, thereby realizing the signal shielding of the wall of the blind groove and the high-frequency multilayer printed circuit blind groove without interfering signals at the bottom of the blind groove. |
| priorityDate | 2017-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 16.