http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107817649-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1078 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2017-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107817649-B |
| titleOfInvention | Photosensitive resin composition, polyamide resin and its production method, compound and its production method, cured film and its production method |
| abstract | The present invention relates to a photosensitive resin composition, a polyamide resin, a method for producing the same, a compound and a method for producing the same, a cured film, and a method for producing the same. The present invention provides a photosensitive resin composition capable of forming a cured film having good adhesion to a substrate and excellent transparency, a polyamide resin that can be suitably used in the photosensitive resin composition, and a method for producing the polyamide resin , Compound that can be suitably used as a raw material of the polyamide resin, a method for producing the compound, a method for producing a cured film using the above-mentioned photosensitive resin composition, and a cured film formed by curing the above-mentioned photosensitive resin composition . In the photosensitive resin composition containing the resin (A) and the photopolymerization initiator (B), a unit containing not only a specific saturated alicyclic skeleton but also a polymerizable group having a predetermined structure in at least one of the carboxyl groups is used The polyamide resin of the structural unit obtained by esterification is used as resin (A). |
| priorityDate | 2016-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 547.