http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107734923-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f7ef5ddd114a4fd2108b9ee66e4631e9 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-061 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-2039 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 |
filingDate | 2017-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea0f73582806f03bf5ce7d5251c9d967 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e87b0e963b2c05c814e6672adde689e6 |
publicationDate | 2018-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-107734923-A |
titleOfInvention | A kind of new controller |
abstract | The present invention relates to a kind of new controller, paster power tube aluminium base is connected with die casting heat dissipation base;The fitting of water conservancy diversion heat conduction aluminum component is fixed on above paster power tube aluminium base;PCB negative pole water conservancy diversion copper posts are installed vertically on paster power tube aluminium base;Function port pcb board is fixed on above PCB negative pole water conservancy diversion copper posts;Except one and function port pcb board vertical connection, remaining is vertically fixed on water conservancy diversion heat conduction aluminum component water conservancy diversion heat conduction copper post;Lid is tightly connected with die casting heat dissipation base in sealing, and is bolted;The through hole that can pass through water conservancy diversion heat conduction copper post is correspondingly provided with function port pcb board and sealing on lid, the outside that water conservancy diversion heat conduction copper post is covered in sealing is provided with sealing ring.Using copper post, aluminum component, carry out high current and quickly export to heat dissipation base, avoid contact of the heat caused by high current with PCB electronic components, reduce the damage of element, improve performance, reduction is reprocessed. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113784590-A |
priorityDate | 2017-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.