http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107723776-B

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-246
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D11-24
filingDate 2017-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-107723776-B
titleOfInvention Two-step environment-friendly nickel-free hole sealing process for anodic aluminum oxide film
abstract The invention relates to a two-step environment-friendly nickel-free hole sealing process for an anodic aluminum oxide film, which comprises the steps of adopting normal-temperature nickel-free hole sealing agent sealing and high-temperature alkali-resistant hole sealing treatment successively on a metal substrate subjected to anodic oxidation treatment, wherein the normal-temperature nickel-free hole sealing agent is an aqueous solution, and comprises 40-60g/L of diethylhydroxylamine, 10-30g/L of monoethanolamine, 1-15g/L of nonionic surfactant and 1-20g/L of citric acid or ammonium citrate; the high-temperature alkali-resistant sealing agent is an aqueous solution and comprises 20-50g/L of sodium silicate, 10-30g/L of anionic surfactant, 10-40g/L of sodium hydroxide, 3-15g/L of isooctanol and 0.1-3g/L of ethylhexyl mercaptofatty acid. The hole sealing process has a good hole sealing effect.
priorityDate 2017-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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